Chapter1

ExecutiveSummary

TheMarket1-1

IntroductiontotheU.S.ElectronicsChemicalsMarket1-1

TheProcessChain1-3

DriversandRestraints1-4

KeyMarketDrivers1-4

KeyMarketRestraints1-4

MarketIssues1-4

MarketandTechnicalTrends1-5

MajorResearchFindings1-5

Chapter2

IndustryDefinitionandChallenges

IndustryChallenges2-1

CustomizationofProductstoSuitSpecificCustomerNeeds2-2

UpGradationofTechnology-InvestinginResearchandDevelopment2-2

DecreaseinPriceinEnd-userMarket2-2

RawMaterialSupplyChain2-2

LargeMultinationalCustomersForcingElectronics

ChemicalsManufacturerstoExpandGlobally2-3

EnvironmentalRegulations2-3

DefinitionandGlossaryofTerms2-4

ListofAbbreviations2-7

Chapter3

TotalU.S.ElectronicChemicalsMarket

IntroductiontoElectronicChemicals3-1

ICMarket3-3

MarketEngineeringMeasurements3-9

MarketForecastandTrends3-10

MarketDrivers3-10

GrowthintheDemandofPersonalComputersandMobilePhones3-10

IncreasedDemandforNewerMicrochipsDrivesGrowth3-11

IndustryConsolidationFavorsMarketGrowth3-11

MarketRestraints3-11

CompetitionfromChinaLimitsMarketGrowth3-12

BargainingPoweroftheCustomersLimitsProfitMargins，3-12

NewTechnologyDeviceAdoptionRateLimitsMarketGrowth3-13

RevenueForecasts3-13

CompetitiveAnalysis3-16

CompetitiveStructure3-16

Porter'sFiveForceModel3-17

Rivalry3-17

ThreatofSubstitutes3-18

BuyerPower3-19

SupplierPower3-19

StrategicRecommendations3-20

ImportantTipsforMakingStrategicDecisions3-21

StrategytoImproveProfitMargin3-22

StrategytoImproveROI3-22

StrategytoCountertheComplexityinNewMaterialIntegration3-22

StrategytowardGlobalExpansion3-23

TechnologyInnovationandProductInnovation3-23

CompanyAnalysis3-23

AirProductsandChemicalsInc3-23

Introduction3-23

ElectronicsandPerformanceMaterialsDivision3-24

Sales3-24

Personnel/Employees3-27

Honeywell3-27

ProductRange3-28

Sales3-28

Employees3-29

GeneralChemicalPerformanceProductsLLC3-30

GCC3-30

ProductRange3-30

MallinkrodtBaker3-31

ProductRange3-31

RohmandHaas3-31

ProductRange3-32

Sales3-32

JSRCorporation3-35

ProductRange3-35

Personnel3-36

Sales3-36

TOK3-37

ProductRange3-37

Sales3-37

ShinEtsu3-38

ProductRange3-39

Sales3-40

CabotMicroelectronics3-41

ProductRange3-41

Personnel3-42

Sales3-42

HitachiChemicalCompany3-43

ProductRange3-44

Personnel3-44

PlanarSolutions3-46

CompanyOverview3-46

ProductRange3-46

FinancialInformation3-46

DowChemicals3-46

ProductRange3-47

Personnel3-47

ATMI3-47

Chapter4

U.S.WetProcessChemicalsMarket

MarketOverviewandDefinition4-1

MarketOverview4-1

Acids4-1

Bases4-3

Solvents4-4

DryEtchingversusWetEtching4-5

MarketEngineeringMeasurements4-7

MarketForecastandTrends4-8

Challenges；DriversandRestraints4-8

Challenges4-8

ConstantlyChangingDeviceGeometries4-8

ExpectationofExtremeCleanliness4-9

GovernmentRegulation4-9

UncertaintyonROIlimitsR&DInvestments4-9

MarketDrivers4-9

IncreaseinDemandforSemiconductorchipsdrivesgrowth4-10

ComplexChipTechnologiesWarrantUsage4-10

Closeassociationbetweenthesuppliersandsemiconductor

manufacturersforproductandprocessdevelopmentactivities4-11

UseofWetChemicalsforCleaningandEtchingApplicationsdrivesthegrowth4-11

MarketRestraints4-11

ShifttowardDryEtchingReducesDemand4-12

AsianFactor4-12

IncreaseintheManufacturingCostandLoweringPrice

MarginofWetChemicalsRestrainsRevenues4-13

RevenueForecasts4-13

MarketandTechnologyTrends4-16

TechnologyTrends4-16

PricingTrend4-16

OneStopShopforalltheWetChemicals4-17

AlternativeTechnology4-17

AnalysisbyProductType4-17

Acids4-17

Bases4-19

Solvents4-20

CompetitiveAnalysis4-22

CompetitionStructure4-22

Consortium/JointVentures/MergersandAcquisitions4-23

CompetitiveFactors4-23

Productinnovation4-23

MarketShareAnalysis4-24

Chapter5

U.S.PhotoresistMarket

MarketOverviewandDefinition5-1

MarketOverview5-1

MarketEngineeringMeasurements5-4

MarketForecastandTrends5-6

Challenges；DriversandRestraints5-6

Challenges5-6

InvestmentinNewTechnology5-6

BargainingPressurefromCustomers5-7

Drivers5-7

ChangesinChipManufacturingProcessDrivestheGrowth5-7

IncreaseinDemandintheEnd-userMarketImpactsRevenues5-8

IncreaseinDemandforNewerTypeResistDrivestheGrowth5-8

Restraints5-8

RelocationtoAsianCountriesReducesDemand5-8

DelayinIntroductionorOutrightRejectionofthe

NewTechnologybytheChipManufacturers5-9

RevenueForecasts5-9

Trends5-12

Technology5-12

DoublePatternLithography5-13

PricingTrend5-13

CloseAssociationbetweenCustomersandManufacturers5-13

AlternativeTechnology5-13

AnalysisbyProductType5-14

DUV1935-14

MarketOverview5-14

MarketForecasts5-14

IandGLineMarket5-15

MarketOverview5-15

Deep-UVPhotoresist5-17

MarketOverview5-17

MarketForecasts5-17

CompetitiveAnalysis5-18

CompetitiveStructure5-18

MergersandAcquisition/JointVentures/Consortium5-19

MarketShareAnalysis5-20

Chapter6

U.S.ChemicalMechanicalPlanarizationMarket

MarketOverviewandDefinition6-1

MarketOverview6-1

MarketEngineeringMeasurements6-8

MarketForecastandTrends6-9

Challenges；DriversandRestraints6-9

Challenges6-9

MarketFragmentation6-9

Patent6-10

Drivers6-10

ComplexityintheChipTechnologyFavorsUsage6-10

IncreaseinCMPAdoptionRateFavorsGrowth6-11

CopperInterconnects6-11

Restraints6-11

IncreasingMarketFocusonAsiaDeceleratesGrowth6-12

GrowingUseof300mmWaferTechnologyImpedesGrowth6-12

GrowthProductionVolumeallowsEconomiesofScale6-12

EquipmentCompaniesdevelopingNon-CMPTechnology

fortheFutureAffectsGrowth6-13

RevenueForecasts6-13

Trends6-16

Technology6-16

ShiftfromTungstentoCopper6-16

IncreaseinProductRange6-16

DecreaseinAbrasivenessofCMPSlurry6-17

DevelopmentofeCMP6-17

Price6-17

AnalysisbyProductType6-17

CompetitiveAnalysis6-23

CompetitiveStructure6-23

MergersandAcquisition/JointVentures/Alliances6-24

CompetitiveFactors6-25

MarketShareAnalysis6-25

SlurryMarket6-25

PadMarket6-27

Chapter7

U.S.LowKDielectricMarket

MarketOverviewandDefinition7-1

MarketOverview7-1

MarketEngineeringMeasurements7-3

MarketForecastandTrends7-4

Challenges；DriversandRestraints7-4

Challenges7-4

AccommodatingLowKmaterialsin32nm7-4

IntegrationIssues7-5

Drivers7-5

TrendTowardsComplexandSmallerChipsDrivesGrowth7-5

IntegrationandLow-costOwnershipDrivesGrowth7-5

Restraints7-6

RelocationtoAsianRegionsRestraintsGrowth7-6

RevenueForecasts7-6

Trends7-9

TechnologicalTrends7-9

MarketTrends7-10

HighKDielectric7-10

ROHPartnerswithUPChemicalCo.7-11

ROHLicensesALDtechnologyofHarvardUniversity7-11

AnalysisbyProductType7-11

Spin-onDielectric7-11

CVDDielectric7-13

CompetitiveAnalysis7-14

CompetitiveStructure7-14

CompetitiveFactors7-15